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ISL6294
Data Sheet October 4, 2005 FN9174.1
High Input Voltage Charger
The ISL6294 is a cost-effective, fully integrated high input voltage single-cell Li-ion battery charger. The charger uses a CC/CV charge profile required by Li-ion batteries. The charger accepts an input voltage up to 28V but is disabled when the input voltage exceeds the OVP threshold, typically 6.8V, to prevent excessive power dissipation. The 28V rating eliminates the overvoltage protection circuit required in a low input voltage charger. The charge current and the end-of-charge (EOC) current are programmable with external resistors. When the battery voltage is lower than typically 2.55V, the charger preconditions the battery with typically 20% of the programmed charge current. When the charge current reduces to the programmable EOC current level during the CV charge phase, an EOC indication is provided by the CHG pin, which is an open-drain output. An internal thermal foldback function protects the charger from any thermal failure. Two indication pins (PPR and CHG) allow simple interface to a microprocessor or LEDs. When no adapter is attached or when disabled, the charger draws less than 1A leakage current from the battery.
Features
* Complete Charger for Single-Cell Li-ion/Polymer Batteries * Integrated Pass Element and Current Sensor * No External Blocking Diode Required * Low Component Count and Cost * 1% Voltage Accuracy * Programmable Charge Current * Programmable End-of-Charge Current * Charge Current Thermal Foldback for Thermal Protection * Trickle Charge for Fully Discharged Batteries * 28V Maximum Voltage for the Power Input * Power Presence and Charge Indications * Less Than 1A Leakage Current off the Battery When No Input Power Attached or Charger Disabled * Ambient Temperature Range: -40C to 85C * 8 Ld 2x3 DFN Packages * Pb-Free Plus Anneal Available (RoHS Compliant)
Ordering Information
PART NUMBER PART TEMP. MARKING RANGE (C) -40 to 85 PACKAGE PKG. DWG. #
Applications
* Mobile Phones * Blue-Tooth Devices * PDAs * MP3 Players * Stand-Alone Chargers * Other Handheld Devices
ISL6294IRZ-T 94Z (Note)
8 Ld 2x3 DFN L8.2x3 (Pb-free)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pinout
ISL6294 (8 LD DFN) TOP VIEW
VIN PPR CHG EN
1 2 3 4
8 7 6 5
BAT IREF IMIN GND
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ISL6294
Absolute Maximum Ratings (Reference to GND)
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 30V IMIN, IREF, BAT, CHG, EN, PPR . . . . . . . . . . . . . . . . . . . -0.3V to 7V ESD Rating Human Body Model (Per EIA JESD22 Method A114-B) . . . . .3kV Machine Model (Per EIA JED-4701 Method C-111) . . . . . . . .200V
Thermal Information
Thermal Resistance JA (C/W) JC (C/W) DFN Package (Notes 1, 2) . . . . . . . . . . 59 4.5 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150C Maximum Storage Temperature Range . . . . . . . . . . . -65C to 150C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300C
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-40C to 85C Maximum Supply Voltage (VIN Pin). . . . . . . . . . . . . . . . . . . . . . 28V Operating Supply Voltage (VIN Pin). . . . . . . . . . . . . . . . 4.5V to 6.5V Programmed Charge Current . . . . . . . . . . . . . . . . 100mA to 900mA
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 2. For JC, the "case temp" location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Typical Values Are Tested at VIN = 5V and the Ambient Temperature at 25C. All Maximum and Minimum Values Are Guaranteed Under the Recommended Operating Supply Voltage Range and Ambient Temperature Range, Unless Otherwise Noted. SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
PARAMETER POWER-ON RESET Rising POR Threshold Falling POR Threshold VIN-BAT OFFSET VOLTAGE Rising Edge Falling Edge OVERVOLTAGE PROTECTION Overvoltage Protection Threshold OVP Threshold Hysteresis STANDBY CURRENT BAT Pin Sink Current VIN Pin Supply Current VIN Pin Supply Current VOLTAGE REGULATION Output Voltage PMOS On Resistance CHARGE CURRENT (Note 5) IREF Pin Output Voltage Constant Charge Current Trickle Charge Current End-of-Charge Current EOC Rising Threshold
VPOR VPOR
VBAT = 3.0V, use PPR to indicate the comparator output.
3.3 3.1
3.9 3.6
4.3 4.15
V V
VOS VOS
VBAT = 4.0V, use CHG pin to indicate the comparator output (Note 3)
10
90 50
150 -
mV mV
VOVP
(Note 4) Use PPR to indicate the comparator output
6.5 100
6.8 240
7.1 400
V mV
ISTANDBY IVIN IVIN
Charger disabled or the input is floating Charger disabled Charger enabled
-
300 400
1.0 400 600
A A A
VCH rDS(ON)
4.3V < VIN < 6.5V, charge current = 20mA VBAT = 3.8V, charge current = 0.5A
4.158 -
4.20 0.6
4.242 -
V
IIREF ICHG ITRK IMIN
VBAT = 3.8V RIREF = 24.3k, VBAT = 2.8V - 4.0V RIREF = 24.3k, VBAT = 2.4V RIMIN = 243k RIMIN = 243k
1.18 450 70 33 325
1.22 500 95 45 380
1.26 550 130 57 415
V mA mA mA mA
PRECONDITIONING CHARGE THRESHOLD Preconditioning Charge Threshold Voltage Preconditioning Voltage Hysteresis VMIN VMINHYS 2.45 40 2.55 100 2.65 150 V mV
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ISL6294
Electrical Specifications
Typical Values Are Tested at VIN = 5V and the Ambient Temperature at 25C. All Maximum and Minimum Values Are Guaranteed Under the Recommended Operating Supply Voltage Range and Ambient Temperature Range, Unless Otherwise Noted. (Continued) SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
PARAMETER INTERNAL TEMPERATURE MONITORING Charge Current Foldback Threshold (Note 6) LOGIC INPUT AND OUTPUTS EN Pin Logic Input High EN Pin Logic Input Low EN Pin Internal Pull Down Resistance CHG Sink Current when LOW CHG Leakage Current When HIGH PPR Sink Current when LOW PPR Leakage Current When HIGH NOTES:
TFOLD
100
115
130
C
1.3 100 Pin Voltage = 1V VCHG = 6.5V Pin Voltage = 1V VPPR 6= 6.5V 10 10 -
200 20 20 -
0.5 400 1 1
V V k mA A mA A
3. The 4.0V VBAT is selected so that the CHG output can be used as the indication for the offset comparator output indication. If the VBAT is lower than the POR threshold, no output pin can be used for indication. 4. For junction temperature below 100C. 5. The charge current can be affected by the thermal foldback function if the IC under the test setup cannot dissipate the heat. 6. This parameter is guaranteed by design, not tested.
Pin Descriptions
VIN - Power input. The absolute maximum input voltage is 28V. A 0.47F or larger value X5R ceramic capacitor is recommended to be placed very close to the input pin for decoupling purpose. Additional capacitance may be required to provide a stable input voltage. PPR - Open-drain power presence indication. The opendrain MOSFET turns on when the input voltage is above the POR threshold but below the OVP threshold and off otherwise. This pin is capable to sink 10mA (minimum) current to drive an LED. The maximum voltage rating for this pin is 7V. This pin is independent on the EN-pin input. CHG - Open-drain charge indication pin. This pin outputs a logic LOW when a charge cycle starts and turns to HIGH when the end-of-charge (EOC) condition is qualified. This pin is capable to sink 10mA min. current to drive an LED. When the charger is disabled, the CHG outputs high impedance. EN - Enable input. This is a logic input pin to disable or enable the charger. Drive to HIGH to disable the charger. When this pin is driven to LOW or left floating, the charger is enabled. This pin has an internal 200k pull-down resistor. GND - System ground. IMIN - End-of-charge (EOC) current program pin. Connect a resistor between this pin and the GND pin to set the EOC
current. The EOC current IMIN can be programmed by the following equation:
11000 I MIN = ---------------R IMIN ( mA )
Where RIMIN is in k. The programmable range covers 5% (or 10mA, whichever is higher) to 50% of IREF. When programmed to less than 5% or 10mA, the stability is not guaranteed. IREF - Charge-current program and monitoring pin. Connect a resistor between this pin and the GND pin to set the charge current limit determined by the following equation:
12089 I REF = ---------------R IREF ( mA )
Where RIREF is in k. The IREF pin voltage also monitors the actual charge current during the entire charge cycle, including the trickle, constant-current, and constant-voltage phases. When disabled, VIREF = 0V. BAT - Charger output pin. Connect this pin to the battery. A 1F or larger X5R ceramic capacitor is recommended for decoupling and stability purposes. When the EN pin is pulled to logic HIGH, the BAT output is disabled. EPAD - Exposed pad. Connect as much as possible copper to this pad either on the component layer or other layers through thermal vias to enhance the thermal performance.
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FN9174.1 October 4, 2005
ISL6294 Typical Applications
TO INPUT VIN C1 IREF IMIN RIMIN TO BATTERY BAT RIREF R1 R2 C2
D1
D2
ISL6294
CHG OFF EN ON GND PPR
FIGURE 1. TYPICAL APPLICATION CIRCUIT INTERFACING TO INDICATION LEDs
COMPONENT DESCRIPTION FOR FIGURE 1 PART C1 C2 RIREF RIMIN R1, R2 D1, D2 DESCRIPTION 1F X5R ceramic cap 1F X5R ceramic cap 24.3k, 1%, for 500mA charge current 243k, 1%, for 45mA EOC current 300, 5% LEDs for indication
COMPONENT DESCRIPTION FOR FIGURE 2 PART C1 C2 RIREF RIMIN R1, R2 DESCRIPTION 1F X5R ceramic cap 1F X5R ceramic cap 24.3k, 1%, for 500mA charge current 243k, 1%, for 45mA EOC current 100k, 5%
TO INPUT VIN C1
TO BATTERY BAT RIREF IREF IMIN RIMIN C2
OFF EN ON
ISL6294
VCC
R1 CHG GND PPR
R2 TO MCU
FIGURE 2. TYPICAL APPLICATION CIRCUIT WITH THE INDICATION SIGNALS INTERFACING TO A MCU
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FN9174.1 October 4, 2005
ISL6294
VIN VOS VREF POR PRE REG BAT
BAT
VCC VREF EN
PPR
CHARGE CONTROL
200K EN VCC DIE TEMP GND 115C
CHG
IMIN
IREF
FIGURE 3. BLOCK DIAGRAM
TRICKLE 4.2V IREF
CC
CV
CHARGE VOLTAGE 76%I REF CHARGE CURRENT
2.55V
19%IREF
IMIN
CHG
CHG INDICATION
FIGURE 4. TYPICAL CHARGE PROFILE
TIME
Description
The ISL6294 charges a Li-ion battery using a CC/CV profile. The constant current IREF is set with the external resistor RIREF (See Figure 1) and the constant voltage is fixed at 4.2V. If the battery voltage is below a typical 2.55V tricklecharge threshold, the ISL6294 charges the battery with a trickle current of 19% of IREF until the battery voltage rises above the trickle charge threshold. Fast charge CC mode is maintained at the rate determined by programming IREF until the cell voltage rises to 4.2V. When the battery voltage reaches 4.2V, the charger enters a CV mode and regulates the battery voltage at 4.2V to fully charge the battery without the risk of over charge. Upon reaching an end-of-charge (EOC) current, the charger indicates the charge completion with the CHG pin, but the charger continues to output the 4.2V voltage. Figure 4 shows the typical charge waveforms after the power is on. The EOC current level IMIN is programmable with the external resistor RIMIN (See Figure 1). The CHG signal turns
FN9174.1 October 4, 2005
5
ISL6294
to LOW when the trickle charge starts and rises to HIGH at the EOC. After the EOC is reached, the charge current has to rise to typically 76% IREF for the CHG signal to turn on again, as shown in Figure 4. The current surge after EOC can be caused by a load connected to the battery. A thermal foldback function reduces the charge current anytime when the die temperature reaches typically 115C. This function guarantees safe operation when the printedcircuit board (PCB) is not capable of dissipating the heat generated by the linear charger. The ISL6294 accepts an input voltage up to 28V but disables charging when the input voltage exceeds the OVP threshold, typically 6.8V, to protect against unqualified or faulty ac adapters.
CHG Indication
The CHG is an open-drain output capable to at least 10mA current when the charger starts to charge and turns off when the EOC current is reached. The CHG signal is interfaced either with a micro-processor GPIO or an LED for indication.
EN Input
EN is an active-low logic input to enable the charger. Drive the EN pin to LOW or leave it floating to enable the charger. This pin has a 200k internal pulldown resistor so when left floating, the input is equivalent to logic LOW. Drive this pin to HIGH to disable the charger. The threshold for HIGH is given in the ES (Electrical Specification) table.
PPR Indication
The PPR pin is an open-drain output to indicate the presence of the ac adapter. Whenever the input voltage is higher than the POR threshold, the PPR pin turns on the internal open-drain MOSFET to indicate a logic LOW signal, independent on the EN-pin input. When the internal opendrain FET is turned off, the PPR pin should leak less than 1A current. When turned on, the PPR pin should be able to sink at least 10mA current under all operating conditions. The PPR pin can be used to drive an LED (see Figure 1) or to interface with a microprocessor.
IREF Pin
The IREF pin has the two functions as described in the Pin Description section. When setting the fast charge current, the charge current is guaranteed to have 10% accuracy with the charge current set at 500mA. When monitoring the charge current, the accuracy of the IREF pin voltage vs. the actual charge current has the same accuracy as the gain from the IREF pin current to the actual charge current. The accuracy is 10% at 500mA and is expected to drop to 30% of the actual current (not the set constant charge current) when the current drops to 50mA.
Operation Without the Battery
The ISL6294 relies on a battery for stability and is not guaranteed to be stable if the battery is not connected. With a battery, the charger will be stable with an output ceramic decoupling capacitor in the range of 1F to 200F. The maximum load current is limited by the dropout voltage or the thermal foldback.
Power-Good Range
The power-good range is defined by the following three conditions: 1. VIN > VPOR 2. VIN - VBAT > VOS 3. VIN < VOVP where the VOS is the offset voltage for the input and output voltage comparator, discussed shortly, and the VOVP is the overvoltage protection threshold given in the Electrical Specification. All VPOR, VOS, and VOVP have hysteresis, as given in the Electrical Specification table. The charger will not charge the battery if the input voltage is not in the powergood range.
Dropout Voltage
The constant current may not be maintained due to the rDS(ON) limit at a low input voltage. The worst case on resistance of the pass FET is 1.2 the maximum operating temperature, thus if tested with 0.5A current and 3.8V battery voltage, constant current could not be maintained when the input voltage is below 4.4V.
Input and Output Comparator
The charger will not be enabled unless the input voltage is higher than the battery voltage by an offset voltage VOS. The purpose of this comparator is to ensure that the charger is turned off when the input power is removed from the charger. Without this comparator, it is possible that the charger will fail to power down when the input is removed and the current can leak through the PFET pass element to continue biasing the POR and the Pre-Regulator blocks shown in the Block Diagram.
Thermal Foldback
The thermal foldback function starts to reduce the charge current when the internal temperature reaches a typical value of 115C.
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FN9174.1 October 4, 2005
ISL6294 Applications Information
Input Capacitor Selection
The input capacitor is required to suppress the power supply transient response during transitions. Mainly this capacitor is selected to avoid oscillation during the start up when the input supply is passing the POR threshold and the VIN-BAT comparator offset voltage. When the battery voltage is above the POR threshold, the VIN-VBAT offset voltage dominates the hysteresis value. Typically, a 1F X5R ceramic capacitor should be sufficient to suppress the power supply noise.
700 RON LIMITED CHARGE CURRENT (mA) THERMAL LIMITED
RIREF INCREASES
JA or TA INCREASES VBAT INCREASES
Output Capacitor Selection
The criteria for selecting the output capacitor is to maintain the stability of the charger as well as to bypass any transient load current. The minimum capacitance is a 1F X5R ceramic capacitor. The actual capacitance connected to the output is dependent on the actual application requirement.
4.0
4.5
5.0
5.5
6.0
6.5
Charge Current Limit
The actual charge current in the CC mode is limited by several factors in addition to the set IREF. Figure 5 shows three limits for the charge current in the CC mode. The charge current is limited by the on resistance of the pass element (power P-channel MOSFET) if the input and the output voltage are too close to each other. The solid curve shows a typical case when the battery voltage is 4.0V and the charge current is set to 700mA. The non-linearity on the RON-limited region is due to the increased resistance at higher die temperature. If the battery voltage increases to higher than 4.0V, the entire curve moves towards right side. As the input voltage increases, the charge current may be reduced due to the thermal foldback function. The limit caused by the thermal limit is dependent on the thermal impedance. As the thermal impedance increases, the thermal-limited curve moves towards left, as shown in Figure 5.
INPUT VOLTAGE (V)
FIGURE 5. CHARGE CURRENT LIMITS IN THE CC MODE
Layout Guidance
The ISL6294 uses a thermally-enhanced DFN package that has an exposed thermal pad at the bottom side of the package. The layout should connect as much as possible to copper on the exposed pad. Typically the component layer is more effective in dissipating heat. The thermal impedance can be further reduced by using other layers of copper connecting to the exposed pad through a thermal via array. Each thermal via is recommended to have 0.3mm diameter and 1mm distance from other thermal vias.
Input Power Sources
The input power source is typically a well-regulated wall cube with 1-meter length wire or a USB port. The input voltage ranges from 4.25V to 6.5V under full-load and unloaded conditions. The ISL6294 can withstand up to 28V on the input without damaging the IC. If the input voltage is higher than typically 6.8V, the charger stops charging.
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FN9174.1 October 4, 2005
ISL6294 Dual Flat No-Lead Plastic Package (DFN)
2X A 0.15 C A D 2X 0.15 C B
L8.2x3
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A
E
MIN 0.80 -
NOMINAL 0.90 0.20 REF
MAX 1.00 0.05
NOTES -
A1 A3 b D
6 INDEX AREA B
0.20
0.25 2.00 BSC
0.32
5,8 -
TOP VIEW
D2
// 0.10 C
1.50
1.65 3.00 BSC
1.75
7,8 -
E E2 e k L N 0.20 0.30 1.65
1.80 0.50 BSC 0.40 8 4
1.90
7,8 -
A C SEATING PLANE SIDE VIEW A3
0.08 C
0.50
8 2 3 Rev. 0 6/04
D2 (DATUM B) 1 2 D2/2
7
8
Nd NOTES:
6 INDEX AREA (DATUM A)
NX k
1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D.
E2 E2/2
4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.
NX L N N-1 8 e (Nd-1)Xe REF. BOTTOM VIEW (A1) NX (b) 5 SECTION "C-C" L C L NX b 5 0.10 M C AB
7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389.
CC e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 8
FN9174.1 October 4, 2005

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